Door Industry Sector › Profile Wrapping Machine
Upper and Lower Plate Splicing Machine - CLF-PB300
CLF-PB300 Upper and Lower Plate Splicing Machine is designed for efficient and precise splicing of plates and sheets, supporting substrate widths of 20–300 mm, thicknesses of 10–90 mm and working speeds of up to 25 m/min.
Technical Specifications
| Specification | (L)9945×(W)1210×(H)1720 mm |
|---|---|
| Working Direction | From Right to Left |
| Total Weight | 2.4 Ton |
| Substrate Width | 20-300 mm |
| Sheet Width | 20-200 mm |
| Working Speed | 0-25 m/min |
| Total Power | 15kw |
| Substrate Length | 1500-2500 mm |
| Substrate Thickness | 10-90 mm |
| Sheet Thickness | 5-30 mm |
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